Wuhan firm pioneers laser-cut SiC wafers
By Liu Kun in Wuhan and Wang Songsong? |
chinadaily.com.cn |
Updated: 2025-07-29 19:56
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A Chinese tech firm in Wuhan, Hubei province, has achieved a breakthrough in mass-producing silicon carbide (SiC) wafers at record speeds by using lasers instead of diamond wires. This marks a major technical advancement for electric vehicle makers working on faster charging systems.
SiC ingots, a third-generation semiconductor material, outperforms traditional silicon in high-voltage and high-temperature environments, making it a key component in next-generation electric vehicles that demand faster charging and longer range.
